Designed to lower CPU temperatures effectively, TG-50 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-50 s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs
